Fabrication Process – Poly-Grames

Many technologies for fabrication of microwave circuits are available at Poly-Grames including: printed circuit board on duroid substrates, thin film MHMIC on ceramics, laser machining of metals, ceramics, TMM, etc., and high precision machining on CNC.

MMIC processes are under development. Passive components like capacitors, planar inductors, and air bridges can already be realized.

Our fabrication facilities: MHMIC, MMIC, PCB , CNC and assembly line.

For information for mechanical components machining, please contact Steve Dubé

For information regarding PCB, MHMIC processes or other specific fabrication tecniques, please contact Jules Gauthier

IMPORTANT!

Before sending any fabrication file, please take your time and pass the checklist

Please take note, that if your files don’t comply with the requests, we are not able to process them, hence some major delays will occur.

Please send all your fabrication requests to Traian Antonescu

All the tools you need for your PCB fabrication

Single Layer PCB

Single Layer PCB: Complete fabrication process instructions

Multi Layer PCB

Multi Layer PCB: Complete fabrication process instructions

SIW

PCB multicouches

Antenne multicouche

3D PCB

3D PCB: Complete fabrication process instructions

MHMIC Fabrication

For more information, please contact Traian Antonescu

MHMIC Process

Design rules As Fired Substrate

Minimum line and Gap width = 20 µm
Conductor thickness = 1 µm
Conductor material = Au or Ag
Material = Al2 O3
Substrate thickness = 10 mils
Max. size = up to 1.9 “
Er = 9.9
TangΔ =.001
Resistance = 100 Ώ□
Resistor material is Ti =20 nm thick

MHMIC Lab

Design rules Polish Substrate

Minimum line and Gap width = 10 µm
Conductor thickness = 1 µm
Material = Al2O3 or SiO2
Max size = 1.9″ x 1.9″
Substrate thickness = Up to 30 mils
Resistance = 100 Ώ□
Resistor material is Ti = 20 nm thick

MHMIC Assembly

Practical Advices

For RF ground use open with 180° offset rather than hole
Take care of connector spacing minimum is 0.5 inch
If you planning to use test fixture take care about the offset between connector
If you planning to test with probing station make sure your circuit respect the probe spacing
The laser always make hole larger than draw by 1 mil
The wire bonding we can provide is 0.7 mil
The ribbon is 0.5 X 3 mil
Parasitic inductance of wire bonding 20 pH/ mil
Minimum pad size for wire bonding 3 mil